Packaging & molding

Things to consider

A chip usually needs to be protected against being damaged already at the stage of being a prototype. Occasionally, a simple plastic lid attached over the chip and its wires will be enough protection, but sometimes something more sturdy, such as a ceramic capsule, is needed. The usual procedure is to also mold the chip and its wires in the appropriate adhesive.

What kind of substrate suits my chip?

The preparation leading up to the assembly usually involves choosing to use a metal or ceramic capsule, or to do the mounting directly on the PCB. The ordinary operation in this section is composed by finding the right packaging together with the customer by choosing between the different types of packaging. These two main types of packaging both have their advantages and disadvantages.

A selection of ordinary TO metal capsules

With a relatively more expensive capsule the protection against mechanical damage is better. With the extra protection, and with the correct base, it is easy to change the circuit when in a more complex formation.

By assembling the chip directly on the PCB, a faster coupling with shorter connection times can be achieved by using the correct layout. This is usually the case in RF. If a more robust protection is required, molding can help. Alternatively, a lid can be the solution.