Chip & Sensors

We handle chips and sensors daily

Quite often, flex substrates, MEMS and odd adhesives are sent to us. Perhaps there are ceramic packages, metal objects and a wire variety present. All of which is to be assembled into something useful. To be useful, the structure first has to function electrically. There are also other aspects to consider as the ability to withstand touching, temperature variations, vibrations or electromagnetic influence. The background as a physicist helps with the understanding of the complex spectra of incoming assignments.

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Development & prototypes

Starting point for Mandalon

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Wirebonding & packaging

A chip needs its contacts and protection

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Microelectronics packaging

The simple description is; place the chip and connect it

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Packaging & molding

Preparing the packaging starts with a choice of substrate

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Contact