Chip Packaging - From wafer to useful unit

Bondning

The short step of bonding and packaging a chip is of great importance regarding the performance of the end product. Mandalon’s knowledge and experience from a wide variety of different structures makes us suitable to take care of your chip in the best of ways. Watch the film!

With the experience from all the sensor activities within S-SENCE at Linköping university, Mandalon Technologies HB was founded in 1999. Since then, sensors, MEMS-structures, and ASICs has been packaged in our own microelectronics lab built in 2001. Since 2002 Mandalon Technologies AB is a regular stock company and the ISO 9001:2008 certificate was gained in 2008. In 2017 the certificate was updated to ISO 9001:2015. Read more on our about page.

Is the design of your unit something you are uncertain about? Are there questions about the PCB layout, the chip design or the pad placement? The Design Guide, produced by us at Mandalon together with PhD students at Linköping University and the the nano- and microsystem programme minST, may be of help.

Assembly at Mandalon's lab
Packaging & molding

Preparing the packaging starts with a choice of substrate

Läs mer
Microelectronics packaging

The simple description is; place the chip and connect it

Läs mer
Wirebonding & packaging

A chip needs its contacts and protection

Läs mer
Development & prototypes

Starting point for Mandalon

Läs mer
Contact