Applier Specific IC

This chip category consists of circuits specifically designed for it’s purpose but is not a MEMS or a sensor.

Usually these chips have a great number of I/O’s but the chip may still be small. The result is a tight pitch and the challenge lies in designing a system enabling many wires when also maintaining functionality and the packaging itself is not degrading the performance.

Manually bonded ASIC with a 60µm pitch

Mandalon will happily assist you with suggestions on how to do the best packaging. We can aid you in choosing the best carrier, PCB or standard/custom package and in the end implement the packaging itself.