Wirebonding & packaging

A chip needs its contacts and protection

Connecting a chip may be performed in different ways. Wirebonding has been in use for a long time and is also the normal method for Mandalon. We have access to different wire bonder types, automatical and manual together with ball and wedge.

Lab interior with some wirebonders

A bonded chip will often need to have some mechanical protection, even at the prototype stage. Sometimes a simple plastic lid and a piece of tape will do the trick and sometimes the chip will require a hermetically sealed ceramic package. An easy way out can be to attach a glob top. This is normally done with an epoxy glue or a silicone.