The short step, bonding and packaging of a chip is of great importance regarding the performance of the end product. Mandalon’s knowledge and experience from a wide variety of different structures makes us suitable to take care of your chip in the best of ways.
With the experience from all the sensor activities within S-SENCE at Linköping university, Mandalon Technologies HB was founded in1999. From then, sensor’s, MEMS-structures and ASIC’s has been packaged in our own microelectronics lab built in 2001. Since 2002 Mandalon Technologies AB is a regular stock company and the ISO 9001:2008 certificate was gained in 2008. In 2017 the certificate was updated to ISO 9001:2015.