Chip Packaging - From wafer to useful unit

Bondning

The short step, bonding and packaging of a chip is of great importance regarding the performance of the end product. Mandalon’s knowledge and experience from a wide variety of different structures makes us suitable to take care of your chip in the best of ways.

With the experience from all the sensor activities within S-SENCE at Linköping university, Mandalon Technologies HB was founded in1999. From then,  sensor’s, MEMS-structures and ASIC’s has been packaged in our own microelectronics lab built in 2001. Since 2002 Mandalon Technologies AB is a regular stock company and the ISO 9001:2008 certificate was gained in 2008. In 2017 the certificate was updated to ISO 9001:2015.

Montering i Mandalons labb
Packaging & molding

Preparing the packaging starts with a choice of substrate

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Micro electronics packaging

The simple description is; Place the chip and connect it.

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Wirebonding & packaging

A chip needs its contacts and protection

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Development & prototypes

Starting point for Mandalon

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