Chip Packaging - From wafer to useful unit

Bondning

The short step, bonding and packaging of a chip is of great importance regarding the performance of the end product. Mandalon’s knowledge and experience from a wide variety of different structures makes us suitable to take care of your chip in the best of ways. See our film!

With the experience from all the sensor activities within S-SENCE at Linköping university, Mandalon Technologies HB was founded in1999. From then,  sensor’s, MEMS-structures and ASIC’s has been packaged in our own microelectronics lab built in 2001. Since 2002 Mandalon Technologies AB is a regular stock company and the ISO 9001:2008 certificate was gained in 2008. In 2017 the certificate was updated to ISO 9001:2015.

Direct link: Design Guide

Montering i Mandalons labb
Packaging & molding

Preparing the packaging starts with a choice of substrate

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Micro electronics packaging

The simple description is; Place the chip and connect it.

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Wirebonding & packaging

A chip needs its contacts and protection

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Development & prototypes

Starting point for Mandalon

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Contact